A research team led by Dr. Hyun-Ae Cha at the Korea Institute of Materials Science (KIMS) has developed a groundbreaking heat-dissipating composite material that combines eco-friendliness with cost-effective production. This innovative material, inspired by the properties of egg whites, features a three-dimensional structure made of magnesium oxide (MgO) that significantly enhances thermal conductivity.
The new composite material achieves thermal conductivity up to 2.6 times greater than traditional heat-dissipating composites. Given the increasing performance demands of electronic devices, which generate more heat as they become smaller, effective thermal management is becoming increasingly critical. This is particularly true for electric vehicles (EVs), where inadequate battery cooling can lead to serious safety risks, including fires or explosions.
Traditional thermal interface materials (TIMs) often face limitations in effectiveness due to the random distribution of thermally conductive fillers within a polymer matrix. This random dispersion disrupts thermal pathways, leading to suboptimal performance. While increasing the filler content can improve conductivity, it complicates processing and raises costs, hindering broader application.
To overcome these challenges, the KIMS team employed a protein foaming method that allows for a more efficient particle arrangement. Utilizing the property of egg-white proteins that expand under heat, they successfully created a dense, interconnected network of particles within the composite. This structure facilitates uninterrupted thermal pathways, resulting in a final product with a thermal conductivity of 17.19 W/m·K, showcasing exceptional heat dissipation capabilities.
The use of MgO not only contributes to the lightweight nature of the composite but also keeps production costs low. Impressively, the new material outperforms both aluminum oxide (Al2O3) and nitride-based alternatives. By incorporating the composite with epoxy resin, a polymer typically used with thermal fillers, the team has produced a material ready for real-world applications.
This technology is poised to enhance the performance and reliability of various high-heat-generating devices, including electronic equipment, semiconductor packages, and 5G communication devices. The domestic market for thermal interface materials in South Korea is estimated to exceed KRW 200 billion annually, heavily reliant on imports. The commercialization of this new technology could significantly bolster South Korea’s self-sufficiency in thermal management materials.
Dr. Cha emphasized the dual benefits of their approach, stating, “Through the protein foaming–based process, we can produce high–thermal–conductivity materials in an eco-friendly and cost-effective way.” She further remarked that this study exemplifies the potential for developing lightweight, high-performance heat-dissipating materials.
This research was funded by the National Research Foundation of Korea (NRF) as part of its Nano Materials Technology Development Program. The findings were published on May 28, 2023, in the prestigious journal Advanced Science, where it was also selected as the cover article for Volume 12, Issue 33.
The KIMS, a non-profit government-funded research institute under the Ministry of Science and ICT of South Korea, continues to lead advancements in materials science, addressing various industrial needs through innovative research and development.
